Microelectronic Process Applications Engineer in , Oxfordshire

Applying for the Microelectronic Process Applications Engineer role

About AML: Applied Microengineering Ltd (AML) is an independent private company established in 1992. AML manufactures unique in-situ aligned wafer bonding machines and provides services based around wafer bonding in its new state-of-the-art multi-million pound £ BONDCENTRE facility situated on UK’s premiere science park in Harwell, Oxfordshire. AML’s unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. A new upgrade is also now available to allow polymer embossing, imprinting, NIL and other pattern transfer techniques. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support. AML’s machines and services are sold worldwide via agents & distributors: China, Hong Kong, USA, India, Israel, Europe, Canada, Japan, Korea, Taiwan, Singapore and Australia. AML’s comprehensive BONDCENRE provides services from the development of bonding processes to a commercial bonding service – one off to volume. Associated services include CMP, powder blasting, electroplating, screen printing & metrology, a ‘One Stop’ wafer bonding service AML’s BONDCENTRE offers the perfect venue for those involved in bonded substrates, device fabrication, 3D integration and wafer level packaging. AML believes in referrals from its satisfied customers and word of mouth rather than heavy advertising campaigns History: AML was the first company formed specifically to exploit MEMS technology or Micro-Nano Technology (MNT) as it is now known. After a number of years designing and producing MEMS devices such as Micro sensors and Microfuidic devices, AML changed direction and now focuses on wafer bonding. For further information, please visit XXXXX
Job Title: Microelectronic Process Applications Engineer
Location: Oxfordshire
Salary: £23,000 - £40,000
Type: Full Time
Job Sector: Engineering
Sub Sector: Semiconductors
Job Reference No: Process-Applications-31-3-11

Job Description


Job Title: Process Engineer

Responsible to: BONDCENTRE Manager

Salary: Dependent on experience

Main Duties & Responsibilities:


• Wafer bonding processing – Production (customer jobs) and Development of new processes ( Define and perform experiments, plus necessary metrology and analysis for characterising and optimising various bonding processes)
• Operation of BONDCENTRE equipment CMP, SAM, TTV, powder blast, wafer cleaning, screen printing, powder blasting and electroplating, photolithography, PVD and wet processing again for the development of processes and supply of customer services
• Interpretation and validation of analytical data.
• Liaise with subcontractors for the provision of processes and analytical services not available in-house.
• Submission to journals and presentation at conferences of technical papers on wafer bonding.

Record Keeping / reporting

• Write and abide by process schedules. Produce reports on all process development activities and establish / maintain equipment / process monitoring records.
• Record keeping and adherence to quality systems is very important

Person specification: (Skills, Experience, Qualifications necessary to do the job)

• Minimum 2.1 Degree in physics / chemistry / material science / engineering
• Experience of operating semiconductor fabricating equipment in a clean room
• Experience with wafer bonding preferable
• Industrial experience including working to a quality system

Ability and willingness to be part of a team getting involved and helping out as required.

Special requirements:
Ability to work unsupervised when required

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